Fabrication of three-dimensional electrical connections by means of directed actin self-organization.
Nature Mater. 2013-02-10; 12(5): 416-421
DOI: 10.1038/nmat3569
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1. Nat Mater. 2013 May;12(5):416-21. doi: 10.1038/nmat3569. Epub 2013 Feb 10.
Fabrication of three-dimensional electrical connections by means of directed
actin self-organization.
Galland R(1), Leduc P, Guérin C, Peyrade D, Blanchoin L, Théry M.
Author information:
(1)Institut de Recherches en Technologies et Sciences pour le Vivant, iRTSV,
Laboratoire de Physiologie Cellulaire et Végétale, CNRS/CEA/INRA/UJF, Grenoble
38054, France.
A promising approach to improve the performance of microelectronic devices is to
build three-dimensional (3D) chips made of stacked circuits. However, a major
hurdle lies in the fabrication of dense arrays of electrical interconnections
between these layers, where accessibility is limited. Here we show that the
directed growth and self-organization of actin filaments can offer a solution to
this problem. We defined the shape and orientation of 3D actin networks through
both micropatterning of actin nucleation factors and biochemical control of actin
filament polymerization. Networks growing from two opposing layers were able to
interpenetrate and form mechanically stable connections, which were then coated
with gold using a selective metallization process. The electrical conductivity,
robustness and modularity of the metallized self-organized connections make this
approach potentially attractive for 3D chip manufacturing.
DOI: 10.1038/nmat3569
PMID: 23396247 [Indexed for MEDLINE]